High Precision Module -                           GBN Systems


High Precision Module

High precision module for the high-speed taping of surface mount devices

About this product:

After production semiconductors are tested, selected and packed in blister belt. This unit manages the packaging process by placing and sealing the semiconductor into blister belt. Therefore parts must be positioned precicely. Highest processing speeds raise the level of handling requirements in production.

GBN Achievements:

Production following customer´s details and design.

Manufacturing of single components and parts.

Procurement of purchase parts.

Assembling and wiring.

Adjustment of electronic and pneumatic components.

Complete functional test and documentation following presets.

If you wish to learn more about manufacturing facilities at GBN Systems please contact us here